As known, in the SEM and TEM instruments, the desired materials are illuminated with high energy electron beams. In a SEM instrument, the beam is scanned over the sample, while in a TEM instrument, the beam passes through the sample. For this reason, a SEM image shows surface morphology and surface characteristics of the samples in form of powder or film, while a TEM image displays internal structure and real particle sizes because of operating at high working potential. The origin of the differences in the particles sizes obtained by SEM and TEM images can be understood from the step of sample supplying for these analyses. For an SEM analysis of powdered materials, some powders are usually utilized. The powder is stuck onto a SEM stub and it is coated by Au or other conductors for nonconductive materials. In the case of a TEM analysis, the desired material is usually suspended in a solvent by a high power ultrasonic instrument to spread the sample well. Then, the suspension put onto a TEM grid and let the solution air dry to obtain a thinly sliced sample. Therefore, the images obtained from TEM analysis has higher resolution and the agglomerations could be distinguished with this instrument, while in a SEM image, the agglomerated particles are usually observed with larger sizes. Hence, TEM analysis is the best technique to obtain the real sizes of materials in comparison with SEM analysis, which is difficult to study real particle sizes.

For example, in the enclosed file, we fabricated TiO2/carbon dots nanocomposites by using commercial TiO2 P25 (from Degussa with the average size of nearly 25 nm) to deposit various amounts of C‑Dots over its surface. As clearly seen in Fig. 2a, the nearly spherical particles have agglomerated and the boundaries are evidently observed. During the sample supplying for the TEM analysis, the operator sonicated the sample in a solvent to spread over the grid. That is why, the real particle sizes are observed in Figs. 2(b, c).

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