Suffered Silver peeling on ITO (indium tin Oxide), using HMDS for adhesion. Is contact angle check a good guage to check the adhesiveness? Silver is hydrophilic? and if my surface condition of ITO is hydrophilic too, will it stick due to no delta in Interfacial tension? OR the peeling is due to my HMDS remain or TMAH remain changing the surface condition after developing (open area, no resist? Or is it due to surface contanminant (example, organic compound or resist residue?) Scan show no residue at open area (on ITO surface).
Any solution on how to improve adhesion between ITO (oxide) and silver?
Btw, a O2 plamsa is impossible to use before Silver Evap, only annomia cleaning was used.