Dear all,
I was trying to use DC sputtering to coat around 50 nm silver on both side of a casted PVDF film (thickness around 25 micron). I used a 3d printed ABS mask during the sputtering. I checked the surface morphology under SEM and found no pinholes and severe porosity. I wonder is there other reasons this short circuiting could occur, and potentially how to avoid it.
Thank you very much.
As such stuttering pvd deposition is making film on opposite surface and some coating at angles too that means on sides to...but you mask it from all side properly nd no scope for adatoms to run away in shadow area...then you may be able to prevent it....you can cover with Al foil also if you are not using high temperature in deposition.
Jignesh G. Hirpara Thank you very much for your answer. But would you please explain further 'but you mask it from all side properly nd no scope for adatoms to run away in shadow area...then you may be able to prevent it....'. I think I dont understand this part . Thank you.
From your question, I understood the situation like this you wish to deposit silver at two sides of pvdf sample but you found they were short electrical way....so you can cover the sample with Al foil with window as per your requirement...then repeat it for second side...during the deposition process.
Jignesh G. Hirpara Thank you very much for your answer. May I know the reason of using the metal as mask? I thought you explain it in the first thread but I fail to understand. Thank you.
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