Is it possible to use RIE etching system for etching more than 200 micrometers in depth. I know that for deep etching it is used DRIE etching system but it is more expensive. The difference between DRIE and RIE etching systems is only the rate and the etching speed. Is there any other difference between them? If I would like to create micro-channels with a size equal to 300 micrometers I have to use DRIE etching system. Does it exist another cheaper technology for creation of masters not using silicon as a material. I would like to create polymer micro-channels.