The challenge with conductive glue is preparing it to be able to bear the static, fatigue, cyclic load. Also, current transferring performance comes into play too. Another important thing is CTE mismatch. By assuming that conductive glue can withstand similar load like solder alloys, I would say the next thing would be making it environment friendly. Now a days, we rarely use lead solder which is harmful for human and environment. Rather than, we are using Sn-Ag, Sn-Cu, Sn-Ag-Cu etc.
nanocopper based conductive adhesive show great potential but completely replacing wave soldering will not happen anytime soon due to many factors such as cost, manufacturability on both component and board level. But it might be useful in some application specific areas such as LEDs or IGBTs.
http://ieeexplore.ieee.org/document/7751572/
An interesting futuristic alternative to soldering could be done with the NanoFoil (see link below). Although I have not heard anything about it being used in any electronics assembly.