I want to compare three models will be used to make IC chip. The models consist of:
Model-1 (Silicon carbide, Resin and Silicon nitride)
Model-2 (Tetrahedral amorphous diamond, PVC and Alumina)
Model-3 (Tungsten carbide, Natural rubber and Tungsten)
The materials are used in each model to make composite. In Model-1, SiC is used as upper material, Resin as adhesive and SiN as lower material. Can PVC in Model-2, natural rubber in Model-3 be used in making IC chip? If not, please suggest other isotropic materials.
Dear Md,
welcome,
If i understand your question you want to build build a stack of materials. You have to give what are the properties of the stack you need and what are their uses. You have two metallic layers which you want to join them by a third organic layer. In the first model you selected the resin as an adhesive an intermediate layer. In model 2 and 3 you can use a resin to join the three materials.
Best wishes
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