I have tried a lot a literature regarding pulsed electrodeposition of copper to obtain nanotwinned microstructures. But all of these sheets (or foils) are limited in thickness (less than 50 microns and some of the authors do not even report this). I wonder if there is any limit on the thickness of the foil that can be realistically achieved through pulsed electrodeposition.
I have tried to deposit copper through reported means but as the thickness increases the foil becomes extremely dull and the solution side surface is too uneven.
Can anyone please shed some light on this subject?