Dear Xiaolong Lv , that range of tolerance is quite common for example when you want to couple a computer processor with a heat sink or heat dissipator, and there thermally conductive paste or adhesives are often used with good results.

There are other TIM options that could fulfill your requirements as well, most of them are generically described in the following articles about these materials:

https://en.wikipedia.org/wiki/Thermal_interface_material

https://www.strouse.com/blog/thermal-interface-material-guide

https://forum.digikey.com/t/thermal-interface-materials/13240

https://www.semikron.com/service-support/thermal-interface-materials.html

The kind of TIM would depend not just on the assembly tolerance, it would depend also on your dissipation needs and the properties of your heat source or material. A gel or grease will accommodate fairly well to non flat surfaces or assembly ranges as those described or higher. Greases or pastes and gap fillers will provide a good contact but the assembly will be not very strong. Adhesives will bond the two pieces (source and sink) better and gel pads or other kind of pads will require a mechanical pressure to achieve a good contact between the two surfaces, the less the more gelly the pad will be. That mechanical contact can be achieved by applying pressure or by means of screws or clamps.

Metals and phase charge materials are good options also because their thermal conductivity and in the case of phase charge TIMs because the good contact when they get viscous at a given temperature.

Hope this helps. Good luck with your research. Regards.