I have been trying to make TEM samples using the PIPS system. But sometimes I end up getting a lot of re-deposition layers alothough I keep the time of milling to less than 30 - 45 minutes usually. Are there ways to prevent this?
Gowtham Sriram Jawaharram
I am trying to thin Si substrate which hold Cu thin films. The Cu seems to redeposit some times.
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Volker Klemm
Hi Gowtham, redeposition can be a big problem in the case of only one side thinning (then you have to turn around the specimen at the end and short back clean again), continue in thinning although already a hole has arisen, or in the case of misaligned ion guns. Otherwise increasingly eroded in the relevant area as returns.
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