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Questions related from Gowtham Sriram Jawaharram
I have a 50nm thin Cu film. How do I calculate the deposition rate in Atoms/s instead of A/s. Do I just normalize the thickness by the atomic diameter?
28 June 2021 2,296 3 View
I made a mistake in the units, the units work out now.
17 April 2018 8,142 2 View
For example,in the [011] Zone axis, the (200) reflection is a superlattice reflection, would it's intensity increase to a greater extent compared to the intensity of the fundamental reflection...
24 May 2016 2,634 0 View
I know that edge dislocation could be imaged as the presence or absence of extra half planes in HRTEM images but is it possible to image screw dislocations?
06 May 2016 5,911 4 View
Is the variation sinusoidal as proposed by the column approximation or is there a different functionality? I understand that it would first increase with thickness due to multiple scattering and...
28 April 2016 9,117 3 View
I have been reading about EH for sometime and do not understand why an elliptical illumination is used in this case.
13 December 2015 1,114 5 View
I have been trying to make TEM samples using the PIPS system. But sometimes I end up getting a lot of re-deposition layers alothough I keep the time of milling to less than 30 - 45 minutes...
24 July 2015 8,547 3 View
My film is typically 200nm Cu alloy grown on Si substrate oriented along . I am able to strip the film out of the substrate using adhesive tape but I am unable to transfer it to the...
30 January 2015 3,497 7 View
I am performing co sputtering of Cu - W alloys. But I am not sure of how to determine the parameters that I need to set in order to obtain correct composition. The parameters are mainly power of...
30 December 2014 121 8 View
I am using duct tape/scotch tape to strip Cu thin films from SiO2 wafers. But I am unable to get rid of the tape later. I have tried certain chemicals like acetone, IPA, Ethanol. N- methyl...
04 December 2014 5,376 2 View