Hello, I got stuck on the exfoliation part of PtSe2. I could get flakes of ~15um size with uniform thickness up to 20nm by direct exfoliation on poly-dimethylsiloxane (PDMS). But for experimental work, we require mono/bi-layer flakes (0.52-1.2nm).
However, I also tried the exfoliation on 270nm SiO2/Si substrate, but that did not work. Although the thickness decreases to 10nm, the flake size also reduces to an average of 5-8um. The substrate was cleaned by ultrasonication in Acetone/ IPA and then treated with Oxygen Plasma (50W, 50sccm flow rate) to remove organic adsorbents. For exfoliation processes (on PDMS & SiO2/Si ), we exfoliated the single crystal of PtSe2 on Scotch tape, thinned down it on blank tape three times, and brought the final tape in contact with the substrate.
Can someone suggest to me other crucial parameters/recipes with which I can get thin flakes.
many thanks in advance
You may want to check this thread.
https://www.researchgate.net/post/How_to_mechanically_exfoliate_TMDs_on_SiO2
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