Copper foam with a controlled pore size have been employed in the boiling process. I notice the thermal resistance is high if using a soldering process. The high porosity structure makes the traditional sintering process can not be performed. My questions are as following:
(1) If using the commercial copper foam, is there welding method that can keep a small thermal resistance and without changing the geometry of copper foam?
(2) If using the sintering method to made copper foam, what material can be used as a sacrifice material?
Looking to hear your suggestions and comments. Thanks
Hello Pengtao Wang,
A silver solder can be used for a welding method that can retain small thermal resistances without changing the geometry of the copper foam. This ensures good bonding and good corrosion resistance.
Wishing you a successful project
Emil Yankov
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