Thermal management of electronics/PCB boards purely depends on the power it dissipates (component power dissipations). But the power dissipation values provided by the component suppliers are the maximum power dissipation and in realty on field the power dissipation is far from this max values. So, i am looking into other possible ways to determine this values, through physic or analytically maybe.
Any bit of information would be highly helpful !
Thanking in advance !!!
Regards,
Rajesh.
Hello Rajesh Alayil ,
If you have the circuit diagram, the input waveforms (if these are external to the PCB), and the output loads (if these are external to the PCB), then it is possible to calculate the dissipation of all the piece parts on the PCB using a circuit simulator program. By the way, your statement that "Thermal management of electronics/PCB boards purely depends on the power it dissipates (component power dissipations)." is incomplete as the ways in which heat can leave the PCB through conduction, convection, and radiation are equally important.
Regards,
Tom Cuff
Hi Thomas Cuff , thanks for the information.
I completely agree with you on the importance of heat transfer, but heat transfer effect the temperature value right and not the power dissipation by itself. That was the message which i tried communicating.
I will look into the circuit simulator program which you touched upon, it would be helpful if you could suggest any documents/papers associated with the same.
Thanks & Regards,
Rajesh.
Hi Rajesh Alayil ,
You make an interesting statement, namely that "...heat transfer effect the temperature value right and not the power dissipation by itself." In fact, temperature does affect the dissipation of electrical and electronic components. Components that contain semiconductors, for example, can be easily destroyed because the electrical resistance of semiconductors decreases with increasing temperature leading to increased power dissipation. This why an LED (Light Emitting Diode) usually has an external ballast resistor in series with it, that is unless the LED package has an internal ballast resistor. Components made of metal such as incandescent light bulb, with their tungsten filaments, can easily operate at very high temperatures due to the fact that the electrical resistance of metals increase with increasing temperature limiting their power dissipation. No ballast resistor is needed with an incandescent light bulb; the bulb is its own ballast resistor. The resistors that are essential components in most electronic circuits are also affected by temperature depending on the type of resistors, see [1].
[1] Thomas H. Jones; Electronic Components Handbook; Reston Publishing Company, Inc.;1978; pp. 103-138, Chapter 4 - Fixed Resistors.
I will try to provide you with some circuit simulators information tomorrow.
Regards,
Tom
Dear
You can benefit from this valuable Link about your topic:
"PCB Simulation: How to Simulate a PCB Design"
@https://resources.altium.com/p/pcb-simulation-software
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Also this one:
"PCB thermal calculator & simulation"
@https://www.ti.com/design-resources/design-tools-simulation/models-simulators/pcb-thermal-calculator.html
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"7 Considerations for PCB Power Supply Design"
@https://www.protoexpress.com/blog/pcb-power-supply-design-considerations/
###############
"Five Approaches to Cooling Military Electronics"
@Five Approaches to Cooling Military Electronics
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"Basics: Power dissipation and electronic components"
@https://www.evilmadscientist.com/2012/basics-power-dissipation-and-electronic-components/
################
Online calculator for PCB circuits
@https://www.multi-circuit-boards.eu/en/index.html
I hope it will be helpful..
Best wishes..
I am not aware of a "magic tool" to do so. The most complicated cases I encountered are with CPUs and FPGAs. For CPU there is usually a table that specifies the current consumption under different supply voltages, mode and oscillator frequencies (Watt=I*R). In case of MCU of SOC, every peripheral was such a table as well. But you need to know the current flow in each IO pin from your design (Watt=I*Rio), and add it as well. For FPGA the IDE has an internal tool for that. It account for your logic design, pin assignment and frequencies. Again you need to add the power of each IO pin (Watt=I*Rio).
For the rest of the components, I usually look for the necessary information in the data sheets and schematics. Hope it helps.
The power dissipation was thermal and ignored from this system operated.
Best regards
P. Hakaew
I suggest to simulate your circuit diagram on the MATLAB, where you could find solutions for many of your problems
you have to take the input waveforms (if these are external to the PCB), and the output loads (if these are external to the PCB), then it is possible to calculate the dissipation of all the piece parts on the PCB using a circuit simulator program.
Determining the power dissipation of individual electronic components on a PCB (Printed Circuit Board) requires careful analysis and consideration of various factors. Here's a general approach to determining the power dissipation of individual components:
It's important to note that the above approach provides a general guideline, and the actual power dissipation determination may require additional considerations based on the specific components, circuit design, and measurement techniques. Additionally, advanced power analysis tools or simulation software can aid in accurately estimating power dissipation in complex PCB designs.
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