Dear Experts,
I have struggled with bonding issue for quite sometime. Initially, I plasma bonded (Oxygen and Nitrogen) the PDMS on LiNbO3. The bonding worked for the 1st time, but after a while there was a leakage, so I removed the PDMS and replace with the new PDMS microchannel.
However, the 2nd, 3rd.. time bonding of PDMS on LiNbO3 is very weak and causes internal leakages. Even I wiped/rubbed LiNbO3 with acetone every time before bonding.
Anyone has suggestion on this bonding issue ?
- is it due to a change of LiNbO3 surface composition, with oxygen ?
- any suggestion ?
Best Regards,
Yannapol Sriphutkiat
The process we use is to clean the LN chip with Acetone, then Iso-propanol (IPA) and then Ethanol, (you may wash it with RO water as well at the end); dry it with delicate task wipers or dry air/N2.
To recover LN after a failed bonding, LN+PDMS chip could be left in Ethanol for hours then, PDMS chip will be easily removed. PDMS gets swollen by ethanol. Ethanol can dissolve PDMS but in a very small amount and very slow rate. PDMS residues can be wiped with a ethanol-wet wipe as well. cleaning of the LN chip after a failed bonding all depends to the initial bonding and mix of PDMS. For very thin PDMS films if spin coated, it's harder to get rid of PDMS.
For a good bonding, silicon dioxide can be deposited on the bonding area. this way, initial bonding works much better than the bare LN chip.
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