The question is: what is the purpose of your cleaning?

• An RCA cleaning removes residuals and causes a well-defined surface termination. RCA-SC1 is for particles and organic matter, RCA-SC2 for metallic impurities.
• pure solvents such as water, alcohols and acetone remove particles from the wafer, but they don't do a lot of chemistry to an as-delivered wafer
• HF removes the native oxide layer, but of course it leaves open features on the substrate, so if it goes through air, it will accumulate anything it can get after that.