Can you tell me the electronic components (ECs) dismantling methods/equipments from Printed Circuit Boards (PCBs )(e-waste)?
Can you give me the company names which produces these type of machines?
What are you trying to recover? Most small components aren't worth recovering. Larger ones might be - but there's a very limited market for 10 yr old computer and interface chips. You can recycle the solder - but you will need to decontaminate it as it won't any longer have an optimum eutectic composition - it will contain dissolved copper and the tin / lead (if used) / bismuth etc ratios will be wrong.
I try to dismantle ECs from PCBs to reuse some ECs, to recover solder, Cu and resin. Then, base and valuable metals will be recovered from damaged ECs by hydro/pyrometallurgical processes.
Dismantling components can be done with a process similar to reflow soldering: heat the board until the solder gives way.
Recovering the resin is not possible: a duroplast can only be decomposed to much simpler chemicals. Not to be forgotten: there is a significant amount of glass fibers within the PCB composite.
Metals can be recovered starting with etching, or the whole PCB undergoes a pyrolysis step after which the metals are available either as a mix of metals or 'in the ashes'.
The whole is available in 'industrial dimensions', being difficult to implement on a small scale. Be aware that there is a significant amount of toxic components withing something as 'simple' as a populated PCB, requiring proper treatment of fumes etc.
Regarding etching (I assume this is what yiu are referring to) one would think of either strong acids or cyanides and other complex building agents. As I write this: the use of mercury would be another option.
As you should know: each of these options includes the use of highly toxic components.
The PCB will remain unaffected. Thus, to access the metallization of the inner layers, either have metal recovery follow a pyrolysis step or breakuo the PCBs mechanically.
Dear Muammer Kaya
Fine sand disassembling method is one of the preferred method to dismantle the components.Methylphenyl silicon oil can also be used to dismantle the components.But very small components cannot be recovered using this method.
Is it possible to reuse electronic components after using methylphenyl silicon oil/any liquids/heat up to 250 C?
Reflow soldering has temperatures uo to the range of about 250 °C - following some temperature profile specifications. My experience is that semicondutors 'survive' a single-digit number repetitions of solder cycles. Provided that all additional conditions (eg. case moisture content) are met. There is no warranty, but a high probability. Though reliability and endurance may suffer.
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