I want to improve the adhesion of gold on RTP (substrates), as I want to etch them finally to have electrodes. That Is why I was thinking to deposit Ti or Al layer between substrate and gold. I have two questions, how much thickness of Ti/Al I need to have in order to improve the adhesion?
How this Ti/Al layer will influence the electrical conductivity of gold to my substrate?
I don't know the precise effect of Ti on the Au conductivity, but for your application, I think that you can use Ti. Me, I use the Ti or Cr layer for the adhesion of gold on glass or silicon substrate for plasmonic applications.
For the adhesion layer, you can use Ti or Cr layer. For Ti, you can desposit a thickness of 3-5 nm and for Cr, 2-3 nm of thickness
Thank you Gregory, but the thing is that Oxidative metals such as chromium, used as an intermediate layer, can enhance gold
adhesion, but because chromium diffuses to the gold surface and oxidizes, the top gold layer morphology and electrical properties are affected dramatically.
And whats your opion about the Ti, how it can effect Au conductivity?
As far as I remember Al/Au is not a good mixture. There is people claiming good contacts (http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=05399194) but the procedure is more complex. I have found publications where Mo is used between Au and Al... We used Pt/Ti/Au at some point or Pt/Ni/Au
I don't know the precise effect of Ti on the Au conductivity, but for your application, I think that you can use Ti. Me, I use the Ti or Cr layer for the adhesion of gold on glass or silicon substrate for plasmonic applications.
Thank you Gregory, actually Chromium has a very bad adhesion on our substrates thats why I cant use it anymore. And Juan said that Al and Au has a bad combination. So only left option is Ti, I will try with Ti and lets see how it can influence the conductivity of Au. Thank you guys
Hello all,
I deposited Ti 100 nm on Top of Au (100nm) but during the liftoff process, Ti got peeled off. What can be the reason behind peeling off Ti from Au. Can any one suggest me for better adhesion.
1nm of Ti or Cr should do fine for gold adhesion with glass.
But recently our group has managed to fabricate high quality gold film using APTMS adhesion layer.
https://www.researchgate.net/publication/318251163_High-quality_ultrathin_gold_layers_with_an_APTMS_adhesion_for_optimal_performance_of_surface_plasmon-polariton_based_devices
Article High-Quality Ultrathin Gold Layers with an APTMS Adhesion fo...
Pooja, u need to deposit a thin layer of Cr before depositing gold or silver layer. It improves the adhesion of the layer. For adhesion test, u should try scratch test and tape test.
Take a sharp object and try to run it on ur layer if the layers have good adhesion then they will not peel off. Tape test is done by use a scotch tape , stick it to the layer and pull it. If the layers don't pull off with the tape then ur layers have good adhesion.
Normally for my work I deposit 5/65 nm of Ti/Au for my structures. Ti is excellent in term of adhesion.
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