Dear Nessima,

Did you consider scratch testing as a method for assessing the adhesion?  It could be tricky, particularly if the SiO2 film is thin (I guess it is), but maybe it is possible.

I also saw papers where people use 'fragmentation test' (basically, observation of crack during increasing tensile stress).

For the peel test [that's what you meant in your second sentence, right? ;)  ], I have no suggestion, but maybe this paper and its authors (on researchgate) could help.

Good luck!

Article Effect of Peel Side on Optimum Condition for Measuring Flexi...

Adhesive forces may be measured with an atomic force microscope

Please find the article:

Adhesion Forces Measured by Atomic Force Microscopy in Humid Air

Dana L. Sedin and Kathy L. Rowlen *

Department of Chemistry and Biochemistry, University of Colorado, Boulder Colorado 80309

Anal. Chem., 2000, 72 (10), pp 2183–2189

DOI: 10.1021/ac991198c

You can also do the contact angle measurement of your film for adhesion test....................

Nanoindentation and nanoscratch tests are useful techniques to assess the adhesion strength. However, depth is limited to nanometers. It is doable if the film maximum film thickness is 4 microns. For more details go through below links. It might be helpful.

http://onlinelibrary.wiley.com/doi/10.1002/app.43532/full

http://www.sciencedirect.com/science/article/pii/S0032386116301227

The surface resistivity of materials must be minimum 32-34 dyn/cm for a lamination, after that you will gain good adhesion strenght. You have to make corona solution and check your material corona level. If the corona level is low, you find a local film producer, They can make corona treatment.

I agree with Tomasz Mościcki