I am trying to deposit ceramic oxide thin films from Lithium cobalt oxide target having difference roughness.
Thanks
I see no point with the surface roughness of sputter target. The surface of the sputter target never be constant after every deposition. What affects the deposition rates are the following, Argon/oxygen gas flow, distance between substrate and sputter target and working pressure.
http://iopscience.iop.org/article/10.1088/0022-3727/48/1/015301/meta;jsessionid=F763685630C713665339189496204AD0.c5.iopscience.cld.iop.org
Depending on the material and nature of the change, a difference in the target surface area and possibly absorption impurity may occur, which is dependent on the previous sputtering conditions.
To ensure a constant and measurable deposition rate, regardless of the target surface, I would recommend ensuring you perform a presputter of the target before deposition. This will remove any impurites or alter any surface abnormalities to a constant state before sputtering, allowing you to deposit films with a repeatable deposition rate.
Sputtering pressure has an immense effect on the surface roughness of the growing film.
High sputtering pressures would yield a rough surface, and the problem becomes more severe with increasing power.
Lowering the sputtering pressures would yield films which are more smooth.
K. Sreenivas
Dear Yellareswara
Yes, I agree with the answers above. Because The surface roughness in a lower layer will influence the surface roughness of all layers deposited onto it. So as I understand If you want different layers you have to know the parameter which can affect in thickness of the layers such as the parameter of time (increasing the time give more different ruffeness layers)
yes it does; The group of D. Depla in Ghent, Belgium (DRAFT group) has worked a lot on the effect of local angle efeects which has to do with roughness.
If the roughness is not too bad then there will be no problem on the deposition rate
It may affect the deposition rate. You need to consider also the power or current input, gas ambient and pressure. You may also need to consider the limitation of the roughness that may effect your sample.
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