We've been trying to manually cut Fused Silica (diameter of 100 mm, thickness of 500um) the way we normally proceed with Silicon wafers: by marking the cut with a diamond tip, cleaving the wafer and applying even pressure with a plier. Nonetheless, this approach always results in cuts that are not straight and perpendicular to the flat of the wafer. Any ideas on how to cut these wafers without any expensive equipment?
Sylvester Peter Antai
Compared to normal glass, fused silica has a higher transmission in the ultra violet and infra red spectrum, a very low thermal expansion.....The fused silica blocks are cut into wafers, and the wafers finally polished. For more details consult https://www.microchemicals.com
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