I have microparticles of Si3N4 that is coated with cupper using electrolees method. What does method can be use to determine the probably phases from center of powder to external surface and interface of powder-cupper?
This is tricky, but you can spread the powder on a glass and use regular metallography epoxy to glue it. After curing you can slightly grind the powder on very fine SiC paper. Then coat it with thin film of carbon and take it to SEM with either WDS or EDS an use line scan mode. With these methods you can detect the boundary of copper on si3n4. Good luck.