See the attachments, both purely reactive sputtering using a Zn-metal target plus a sulfur-containing reactive gas component in the sputter plasma as well as sputtering from a ZnS target are feasible - it depends on what you have at hand if its urgent. Easier is in my opinion the use of a ZnS target, in that case I guess that the S partial pressure has only a minor influence on the growth parameters, the substrate temperature is probably more important here. In the case of a purely reactive process, both the S partial pressure as well as the substrate temperature as well as a post deposition annealing procedure are recommended. Good luck, Dirk
You should be able to, yes. I recently read this thesis, which has some information on sputtering ZnS using an RF system with turbopump, backed by a rotary vane pump. Chapter 3, in particular, might be useful to you:
See the attachments, both purely reactive sputtering using a Zn-metal target plus a sulfur-containing reactive gas component in the sputter plasma as well as sputtering from a ZnS target are feasible - it depends on what you have at hand if its urgent. Easier is in my opinion the use of a ZnS target, in that case I guess that the S partial pressure has only a minor influence on the growth parameters, the substrate temperature is probably more important here. In the case of a purely reactive process, both the S partial pressure as well as the substrate temperature as well as a post deposition annealing procedure are recommended. Good luck, Dirk
I've used ZnS quite a lot in optical coating, but via evaporation in a box-coater type system with diffusion pump, so not sure about problems with turbopump. As for contamination, if I've used ZnS, it's usually better to completely strip down and clean the deposition system before working with other materials again. It does seem to 'spread' thoughout the machine quite extensively and can sometimes cause contamination problems. Also, it smells quite bad!
I should add that I do use ZnS along with some other materials in depositing multilayer coatings, for instance yttrium fluoride, germanium, etc., without problems.
I'm not sure how valuable my opinion would be, since I don't have personal experience of sputtering the material, only evaporation. But if there is some problem, you can always clean the system afterward - bead blasting, solvent wash, etc.
This is, of course, quite easy if you have removable chamber shields.
of course you will find the ZnS all in your chamber, and, yes, this may influence the work of others, as well as yours might be influenced by the others if they are not working clean ...
One quite easy thing that you may think of is to cover the entire chamber from the inside with aluminum foil - if your process conditions are not to aggressive (in terms of temperature and gas composition) then the Al should not react and contaminate your system. Of course the Aluminum is not so good for the evacuation of the system, and you may "import" e.g. carbon and water contaminations, but the Al will shield the vacuum chamber from your ZnS, and your samples from the contaminations in the chamber. And you may remove your ZnS-covered Al after you have processed your samples without disturbing the experiments of your colleages ... Good luck, Dirk
Dear Anantha, what about setting a small, new vacuum chamber only for your purposes? If a sputter target and all the electronics are available, you do not need that mcuh additional equipment: A pump, a vacuum vessel, a gas inlet - and that's it. Good luck, Dirk
In terms of CuS and SnS - they may all behave different becuase of their thermodynamics. They all have different heats of formation etc, and thus it may be dangerous to apply general rules. I think Ross idea of evaporating ZnS is maybe a good option, although films may be oxygen deficient. I remember that we prepared ZnS films by evaporation a long time ago, however the adhesion on the substrates was poor as far as I remember. Hope this helps, Dirk