Make sure there are no air bubbles under the tape and with a quick move remove tape. If you have broken layers they can be removed with the corner of a piece of tape by gently touching the broken layer.
There is no single answer on that, as it depends on various factors like exfoliating technique, tape, substrate cleaning, graphite quality, etc but generally speaking less peeling is going to give you thicker flakes
I am using this method: http://carbon.chem.wisc.edu/Files/MechanicalExfoliation.pdf
but when I use the microscope, I see that my wafer is full of adhesive.
Any suggestion to reduce the adhesive?
Right, do you use any solvents after the exfoliation to clean the residue? Try using Acetone or NMP etc You could also contact the researchers that wrote this .pdf to ask them for details. Good luck!
Cleaning with solvent is one option, the other being thermal annealing in inert atmosphere.. but be careful while choosing the solvent . Acetone may not be a good option..
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