Can a Conductive Anodic Filament (CAF) short go away?

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No title

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The procedure compute?

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what is the simplest definition of ion exchange capacity

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i have some problem with chtMultiRegionSimpleFoam

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Fred Schenkelberg

Thanks Charles, that was my initial thought and haven't found any thing discussing it happening. I would be hard to study, I suppose. cheers, Fred

Ivan Perez Olguin

The use of the high current density may open the CAF short, but the temperature of the trace will be high, with the risk to damage the FR4, CEM material (crate fractures) and after the "normal" PCB operational conditions the damaged material can be the source of more filaments (the Cu will follow the fractures).

For that my recommendation is verify all the operational temperatures of the PCB (Transition glass, ambient, temperature rise expected under specific operational conditions, delamination,...).