We consider purchasing a new notching/scribing tool. The major intended applications using such piece of equipment are as follows:
• Cleaving GaAs/InP/GaSb/InAs laser diodes for smooth facets
• Dicing laser bars
• Photonic Integrated Circuits (PICs) singulation
• Limited-Production Dicing
I wanted to check if any of you have any recommendations for a particular piece of equipment from any vendors (except Loomis), which can do these tasks very reliably. I prefer an automated system rather than a manual one.
Brian Thibeault just saw this neat gadget at a conference:
https://latticegear.com/products/flipscribe-scribing-machine/
The wafer goes face-up, but it scribes on the back, and scribes all the way across the device. Set up basically like a table saw, with your wafer against a sliding "fence" that slides your wafer across the diamond scribe on the underside.
Manual, and possibly good for your lab's needs.
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