Literature says that at 950-1050 for 2-4 hrs the cathode ink adheres to substrate and results in desired porous micro structure. My samples adhere at 1200-1250oC resulting in dense micro structure. Dense micro structure is not desirable and at low temperature below 1200oC, the ink is not gaining the adhesive nature. what steps have to be taken care of to get porous structure and adhesive nature to the cathode ink.
Hi Harshitha,
It depends on the type of organic vehicle which you used. The ink composition (ratio of solvent, dispersant and binder) has to be framed in such a way that active ceramics would adhere on the substrate and the binder (ethyl cellulose or PAA) would be removed while sintering. The porous mictrostructure can be achieved when the organic matters decomopose and evoporate in the temperature 500-900C.
You try to slow sintering rate (3 deg/min) in the furnace at 900-1000C or tune the composition. Generally cathode inks should not be sintered above 1000C in order to get a porous microstructure.
Good luck
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