CuSbS2 powder was dispersed in ethanol and spin coated. after solvent evaporation the powder is coming out of glass substrate.how can overcome this issue. annealing will help to improve adhesiveness of film?
Not an expert in your materials but the old semiconductor answer to bonding problems was 'try a flash sputter coat of titanium'; in your case that would be on the glass slide. I think you might see others are using molybdenum coating. I am sure a modelling chemist would calculate the bonding energetics for you if it doesn't work.
Just the annealing cannot effectively improve the adhesiveness.The powder particle size should be small enough (maybe, lower than 100 nm), and meanwhile the powder has a good monodispersity.