Hi all,
I have to find a way to test the adhesion strength b/w a Cu leadframe and the epoxy molding compound using the 3 point-bend test. Ihave to prepare samples for the same, I am unsure about what sizes of the two (leadframe and EMC) can be used for the test so that they closely represent the real conditions. Also, it'd be helpful if anyone could share the test setup conditions that need to be used.
Thank you
Cu-based leadframe sheets were oxidized in alkaline solutions to produce brown and/or black oxide on the surfaces, and molded with epoxy molding compound (EMC). The adhesion strength of leadframe/EMC interface was measured using sandwiched double-cantilever beam (SDCB) specimens and pull-out specimens. the adhesion strength of leadframe/EMC interface was inherently very poor but could be increased drastically with the nucleation of acicular CuO precipitates
- Badges
- Science topic
- Similar topics
- Chemistry
- Nanotechnology
- Nanostructures
- Thin Films