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Questions related from Udaya Kumar
I need to bind a copper foil to a bulk copper piece (10 mm dia). I cannot apply pressure over the copper foil as it can damage it. Is there any other effective method to accomplish this task?...
10 October 2018 9,380 4 View
I need to disperse the CNT nanoparticles available with me and make a solution which can be easily dip coated on a copper surface. Anybody having experience in this?
05 May 2018 2,733 2 View
Dielectric fluid FC-72 is highly volatile in nature and thus is very difficult to measure its contact angle over plain and nanostructured surfaces. Is there any method by which we can measure the...
12 December 2016 3,416 6 View
What is the importance of three electrodes system in the electrodeposition of nanostructures on copper substrates? Why Pt electrode should be used as the counter electrodes in the coating procedure?
04 April 2016 9,228 1 View
For the fabrication of nanowires using electrodeposition method and alumina templates some journals are available. But, the corresponding values for the fabrication using electrochemical...
02 February 2016 7,356 0 View
I am trying to do sputtering of graphite target of 4" dia and 3 mm thickness on copper substrate. The distance between the target and the substrate is 6cm and substrate temp is 35 deg C. Ar gas...
01 January 2016 3,795 10 View
Electronics cooling using nanostructures How can we increase the performance of vertically aligned carbon nanotubes for electronics cooling?
10 October 2015 5,137 2 View
