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Questions related from Mathu Sridharpanday
1) Crack detection:- To inspect the top wafer to detect cracks from incoming wafer from post back-grind with TiAg deposition supplier. ( crack size : 500nm to 5um) 2) customized inspection...
14 June 2023 609 2 View
I intend to design and build a new / custom ultrasonic probe horns. Recommend a book or article to familiarize ourself with design parameters, mechanical and electrical analysis. 1. What is the...
16 September 2022 7,735 0 View
In many cases, I could see only crystalline nature of Si or SiO2 are choose for wafer substrate applications in semiconductor processing. What is the major differences of both Crystalline and...
25 January 2022 6,407 4 View
I have characterised magnetic materials with VSM. and determined SQR & K values. Is it possible to determine those values when materials not attained saturation from the M-H loop.? In the...
22 April 2021 1,404 4 View
By using Scherrer's equation, I found the individual crystalline size of prepared samples calculated for corresponding peak position from the XRD pattern and taken averages for each sample. e.g:...
16 April 2021 1,540 3 View
I have used crystallographic diffraction measurement for my sample. What is the accuracy of XRD measurement? Is it really 0.01 nm? When stepping into speak about the accuracy, is it necessary to...
15 April 2021 4,552 6 View
Dear Great Scholars from all over world, Here i comes up with a new problem on making Stoichiometric formation of Multi-Metal oxides together. I don't know how to make it. Some...
11 May 2016 1,084 5 View
Hi Doctors & Great scholars, After finding some of myths from electrical, electronic and optical properties of nanomaterials, now i am facing difficulty in electrical...
08 May 2016 505 9 View
At instance, etching is achieved by the two familiar ways. Those are Isotropic and Anisotropic etching. In some cases, vertical etching also majorly attained, that too under direction dependent...
01 January 1970 2,639 4 View
Is there any Simulation software in free of cost either for heat spreader/absorber application studies?
01 January 1970 9,051 4 View