4 Questions 9 Answers 0 Followers
Questions related from Jaising Pednekar
I want to use copper as sacrificial layer in multilayer UV-LIGA process. What kind of etching chemistry should be used to remove copper without affecting nickel structure ?
04 February 2016 9,594 4 View
I am using multistage UV-LIGA process for fabrication of MEMS switches. PVA Tepla microwave plasma asher is used for removing SU-8 mould. The required switching action is governed by metal layer...
08 December 2015 9,682 9 View
We have been observing lot of adhesion related issues while processing MEMS devices using UV-LIGA process. Typical problems such as poor adhesion between thick SU-8 mould and Cr-Au seed layer are...
20 July 2015 2,486 4 View
Multi-level UV-LIGA process development I am developing a multilevel UV-LIGA process for fabrication of some complex passive sensors. At present I am facing some issues related to process...
11 February 2015 449 1 View