It is well known that SiSiC ceramics in some conditions (i.e. temperatures above the melting temperature of Si) show the “sweating phenomenon”. It means that molten silicon in excess inside their microstructure comes out and gathers in drops. If you oxidize a SiSiC ceramic, sweating is not immediate though, it can happen after a long time (again depending upon temperature). The picture shows drop formation at after 40h in air @1600°C. I took a look at these droplets: they are made of silicon with a very low amount of oxygen on the surface. Pure Si expansion cannot be the cause of this massive mass transport, there must be something else.

Any opinion?

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