normally for quicker simulation draw conducting patch and ground plane as a 2D PEC. 3D metal box slightly improve your BW and efficiency however killing most of your time.....and does not add any benefit...
You can take thickness 35 micron or 70 micron ,no other thickness because pcb comes with these thickness only. If you increase thickness more then these then your s11 parameter will increase or decrease depending upon you structure design and practical result will vary form your simulation result.
Thickness of patch does not effect the results significantly. you can have 2D patches for quicker simulations. but in real case the thickness is from 0.035mm to 0.070mm depending on substrate. Rogers have 0.035mm copper clading while Fr4 has 0.070mm.
There is no use of introducing thickness in simulation unless you are making coupler with tight coupling where thickness of edges really matters. You can replace conductor with a 2D sheet and assign finite conductivity boundary conditions to it with conductivity of what copper has. It gives very accurate results and doesnt really change by introducing real thickness.
Thickness depends on skin depth at resonating frequency. In general for fabrication the minimum available is 17.5micron and above. the standard thickness available is 0.5oz [17.5 uM], 1oz , 1.5oz and 2oz. You can use any depending upon skin depth. Gold flash is must to get best results. immersion gold is further improve your result.
First in simulations thickness parameter is not much important, based on perturbation theory.
But if you add the thickness to conducting parts the results would change slightly; The substrate dielectric constant and its thickness has the most impact on results.
When the substrate is selected, the metal thickness is given in datasheet.
more important thing is that at last you should change metal material from PEC to copper or aluminum, based on your substrate datasheet.
I want to know that is it mandatory to put the standard values of substrate material like FR4 and Conductor like copper in antenna designing.Since I have designed an antenna which do not use standard values of dielectric constant and copper thickness .
Smallest patch thickness is possible to achieve radiation with minimum cross-polarization level, small contribution of the non-resonant modes and symmetrical pattern.
Increasing the thickness of the ground plane has reduced the excitation efficiencies of the non-resonant modes.
It’s depends on the substrate you are using. But in genreral there are two standard thickness in thr market : 17 um and 35 um. You can choose one of those values and the results are the same. Good luck