How can the product development teams collaborate by sharing knowledge, tracking engineering requests changes, etc., taking into account the analysis of big data, the tracking in real-time, and all other aspects for the new challenges of NPD?
Is there any PLM software with the capabilities to collect, store, process and retrieve data, information and knowledge?
Refer this too
https://www2.deloitte.com/insights/us/en/focus/industry-4-0/manufacturing-ecosystems-exploring-world-connected-enterprises.html
https://www.i-scoop.eu/industry-4-0/
I think this is not a PLM software issue. This is about the industrial implementation of cyber-physical computing that obviously leads to systems of cyber-physical systems. And a large part of smart connected products will also be implemented as (systems of) cyber-physical systems or anticipating actor nodes of these.
I thank you for your kind contributions @Mahesh Nagarkar and @Imre Horvath.
I think that the 3D parametric modelling platforms are evolving in the direction of integrating a large set of tools that can handle some industry 4.0 challenges.
There is a set of PLM commercial platforms that are designed to work with big data (as an example );
https://www.3ds.com/products-services/exalead/products/exalead-onepart/
However, I think that research is rather aimed at establishing cloud platforms with specific applications for manufacturing processes in industry 4.0 environment.
Please find attached an example related to a cloud platform for injection molding process
Jong, W. R., Chen, S. C., Wang, S. M., Liu, S. H., Liao, H. L., Ting, Y. H., & Chen, H. T. (2017). The Implementation of Cloud Platform for Injection Molding Process. Procedia CIRP, 63, 219-223.
Dear @Cristina Martin-Doñate,
I really thank you for your input. What I have found is that nowadays PLM systems are using Software as a Sevice (SaaS, cloud technology) to integrate external tools for big data analytics. You have provided the DS solution, whereas Siemens PLM offers "Omneo" for such purposes. I will deeply take a look into the recommended paper, since it is very related to my work.
Kind regards,
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