Hello, I am trying to anneal graphene flake on a silica substrate at 250 celcıus degree under vacuum using a standard mechanical pump and a quartz tube. The whole process will take 4 or 5 hours for temperature ramp, dwell and cooling. So during that time, I plan to purge H2 and Ar with 200 and 400 sccm respectively together from the beginning. What will be the max limit of hydrogen gas flow rate (sccm) that ı should use in order not to have a dangerous situation?

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