Most of the people work in the field of research in the field of NiTi, share sputtering condition but not give the NiTi Target sintering process.
Probably because it's a difficult task. The idea is to reach high temperatures close the melting point of Nickel (Ti at 1668 °C and Ni at 1455ºC) under high pressures and, important for further sputtering experiments, in a reducing environement in order not to oxidize the metals. This is sometimes achieved using graphite molds or adding polyethynele glycol (1-3%). Take into account as well dilatometry effects: your starting material is powder and full of pores, voids and air, so it will shrink up to 1 cm and your magnetron head tolerance is about 2 mm. Good luck!
Hi Veeresh?
What is the composition of the target, you would like to produce? What equipment do you have (hot isostatic press, vacuum sintering furnace,..)?
If you have a HIP, I would propose the following process:
- Pressing the powder
- Putting the green part in a Ti can
- Evacuating the can
- Sealing the can
- Compacting the material in a HIP at a temperature depending on the composition (but clearly below the eutectic temperature) under a pressure of > 1000 bar.
Best regards
Gerhard
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