I am trying to fabricate 150 um depth microneedles with 45% KOH solution at 90 degree. What are the best methods available to optimize and predict this procedure ? Are there any optimizations available ?
I have used 1:1 (45%KOH:DI water) at 80 degrees celcius and have gotten an etch rate of ~1um/min for Silicon (111). In my experience you can take the samples out from the solution and measure using a contact profiler and put it back in with minimum stress induced.