Can you recommand a method that is quick and provides good (not necessarily excellent) layers of such thickness?
Marcin:
Best regards.
For 1 micron SiO2 (quite thick) to my understanding the best deposition process should be Plasma-Enhanced Chemical Vapor Deposition (PECVD) technique if you would like to reduce the deposition time. Sputtering should also work in this case. I also found that pulsed laser deposition (PLD) technique is also useful for near 1 micron silicon dioxide thickness. The most versatile technique of all is however atomic layer deposition or ALD process but it is nm level adhesion and for 1 micron it might take unfeasibly longer time that may not be sustainable. I am giving relevant papers for all these processes.
If these papers are useful for your work, please recommend my answer. A recommendation helps the responder's researchgate profile.
Sincerely,
Dr. Nabil Shovon Ashraf.
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