The metal is pipeline steel (X70) and the coating matrix is epoxy.
I need to follow the delamination during applied cathodic potential.
The solution is NS4.
Thanks, Andrey
but do you think is it suitable to follow the progress of delamination.
It may be suitable to detect delamination but may be hard to follow it.
Especially, the sample will be immersed in the solution with applied voltage during the testing course.
Do you think SVET is suitable!
In my experiment, I used a video camera with a good resolution to observe the growth of the copper deposit on the steel nail.
The lens of the video camera was tightly pressed against the wall of a rectangular quartz cell. Then on the PC monitor I measured the thickness of the deposit in time (relatively the known nail size).
Such approach can be used to study the growth of deposits from 50-100 microns.
It seems that better video equipment allows to study thinner deposits.
Thanks Andrey
Could you please recommend articles or a company that using this technique.
Hello, Mohamed!
please, check a link.
http://dx.doi.org/10.1016/j.jelechem.2015.04.031
M. Stratmann and etal., in their article " The scanning Kelvin probe; a new technique for the in situ analysis of the de-lamination of organic coatings", Progress in Organic Coatings, Volume 27, Issues 1–4, January–April 1996, Pages 261-267, stated the possibility with this technique, to follow the de-lamination in situ and to understand the basic corrosion mechanism at the metal/polymer interface. Then, till now this technique is used in coating and corrosion case study to follow the cathodic de-lamination during applied cathodic potential as at the article in the following link.
Best regards
https://www.researchgate.net/publication/262179547_A_cathodic_delamination_study_of_coatings_with_and_without_mechanical_defects
Article A cathodic delamination study of coatings with and without m...
Many thanks,
Dr. Al'Atia, SKP used without any solution just high percent of humid air.
In that case, I have to remove my sample from the solution and the applied voltage will stop. So, I will interrupt the test.
I am thinking to use SVET. The problem in my point of view is that the coating will pop up and I can not put the SVET prob at the same height, so the results will not be accurate
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