Thermal conductivity is a property of the material (not any shape). So whatever alloy of copper your heat sink is made from, the material properties can be found on the web.

If by "cooling efficiency" you mean something more like the heat sink thermal resistance under certain conditions (natural convection, defined gravity vector; forced convection with known air flow), that's often defined by thermal resistance in K/W for that heat sink and the defined conditions. That's more than merely a point to point measurement for most cases.

Thank you for your reply.

According to thermal science, the total thermal conductivity of the material highly depends on the structure. So we do have the thermal conductivity of the material but we need to find the efficiency of the heat sink as well. Some tests like hotplate or flash method.

So I need to know what is the best equipment to employ. Thank you!

You need to run a heat transfer experiment that instrumented properly.

Depending on your heat sink. Is it fin heat sink?

there are several lab experimental setups that can do that based on passing air over the sink and the measured temperatures and calculated h.

Thanks Ahamd,

May I know a few of them? Yes it is fin heat sink. I know hotplate, flash, and etc but looking for more scientific techniques.

You may design your own experiment for that or find a setup in a university and ask them to run the experiment for you.

The thermal conductive of the interface material determines it's thermal performance to a large extend. The hign thermal conductivity of this product guarantees sufficient heat transfer resulting in Better cooling solution and the desired heat dissipation..

Cooling of e.g. an IC can be measured by thermal cameras. They are many types. Imortant is the view-angle of the camera. Main point however is that one cannot normally see the temperatur of the IC. It is the temperature distribution of the chip-dye which may cause damages (hot spots) . Sometimes thermal simulation may help. In foundies Q-screening of an encapsulated IC is usually checked using theramt picture. The processing of the data from camery is question of choice of some macromodel of the arrangement chip - encapsulation -heat sink.

The heating effect, cooling effect and heat dissipation of a material depends on it type. Heatsinks are materials with best positive response to temperature changes, they absorb heat faster and also dissipate heat fast. If you intend knowing the cooling and heating effect of a heat sink, then you need to know the type of metal it is made from. Then you find the temperature coefficient of that metal which is fixed and with the Stefan Boltzmann's constant of temperature characteristics, you will be able to meet your demands