This might sound like a stupid question..just wondering whether people have looked at it yet.
If you are talking about physical vapor deposition, either thermal or e-beam evaporation, you get amorphous films. If you were to use a substrate heater, you may be able to get nanocrystalline or at best polycrystalline films. So your PVD Al or LiF films will not have a major crystal orientation.
As far as Aluminium is concerned, you will get a polycrystalline Aluminium film for physical vapor depositions including e-beam evaporation at RT. I normally gets fcc-Al with mostly all the planes. But at times, the low index planes alone may appear in XRD based on the degree of crystallinity. (if you want amorphous Al, you have to quench the incoming vapor upon reaching the substrate at a very high cooling rate).
For LiF, since it is a compound, I am not sure.
The question sounds indeed a bit "strange" since a plane is a 2D object and your crystals are 3D objects. Therefore, you will have either one (2D) or any number of planes. However, I guess you are asking for a preferred orientation, i.e. which plane is preferably parallel to the interface?
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