I'm interested in transfer printing where thin sacrificial layer is deposited on top of a silicon wafer, and this sacrificial layer is metallized using physical vapor deposition. The idea is that after metallization a flexible substrate could be attached to the metal layer and the layers could be peeled of from the wafer by etching the sacrificial layer.
Has anyone tried this type of process? I'm interested in this mainly because the PVD to silicon wafer is generally much easier than directly to polymers.
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