I was trying to deposit Cr and Au on glass substrate with thickness 30:70. I was getting some problem like:-

1. Au is not getting properly adhesion with Cr.

2. Tried with Ti and Au with thickness 10:45 seems all Au film is getting wipe from Ti. What could be the main issue.

Experts please help me out.

Cleaning process of glass substrate:-

RCA1,2 then pirhana.

then ppr deposit before deposit soft bake at 100 degree.

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