I was trying to deposit Cr and Au on glass substrate with thickness 30:70. I was getting some problem like:-
1. Au is not getting properly adhesion with Cr.
2. Tried with Ti and Au with thickness 10:45 seems all Au film is getting wipe from Ti. What could be the main issue.
Experts please help me out.
Cleaning process of glass substrate:-
RCA1,2 then pirhana.
then ppr deposit before deposit soft bake at 100 degree.