Is there any way to etch mold compound (either SiO2 or Al2o3 filler based, with resin) properly without etching solder alloy? Reactive Ion etching could be an option, however the mold thickness is pretty huge, so in terms of time to complete, the best way would be something based on Chemical etching. Any input will be helpful!
Thanks in advance!
-Happy Researching!
Well SiO2 and Al2O3 both etch in dilute HF (say 5% in water). HF is nasty from a toxicity point of view but is a weak acid, so the solder may stand up for a while. Don't know if it etches the resin though, if you need to etch the resin you'd need to tell us more about what it's made of.
If you do use HF make sure you inform yourself about how to use it safely, it can be lethal if you spill it on yourself and don't treat it quickly.
See if you can use NMP (n-methyl pyrrolidone) to etch the organic mold compound. Warning NMP is a carcinogen. Once the mold compound is etched it is possible the filler can simply be washed away mechanically (say with ultrasonics). If not try what Dr. Schnabel suggested above for the fillers and heed the warning regarding HF safety.
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