Could anyone suggest to me why Molybdenum is peeling off during electrochemical copper deposition? Applied potential during copper deposition is -1.15 V vs Ag/AgCl reference electrode.
The step of experiment is:
(1)Cleaning step of soda lime glass-sonicate with (i) shop solution (ii) DI water (iii)Acetone (iv)DI water(v)IPA (vi)DI water (vii) Dry with N2
(2) Mo is deposited on soda lime glass by sputtering Method (thickness is 1 micron)
(3) cooper electrolyte (3M NaOH, 0.1M CuSO4, 0.2M sorbitol) pH 14.5
Mo is very pressure sensitive. Some types sputtering with high pressures ensures good adhesion but same times it increases resistivity. low pressure films has shown low resistivity but poor adhesion. So inshort you have to optimize pressure for Mo deposition.
i have faced same problem SLG/Mo. I am depositing CZTS on SLG/Mo. But we have optimize the pressure for good adhesion and low resistivity. The problem was solved.
thank you Beladiya Vivek, Can you tell me which method do you follows for CZTS deposition and what pressure used for Mo deposition?
We are using sputtering method. we are depositing at ~5 x 10E-3 mbar.
Mo is coming off because of stress in the Mo film because it is so thick. 1 micron sputtered is really a lot. Better would be 100 nm. You should also not use acetone, it leaves residue. IPA is ok. Plasma cleaning (or ozone cleaning) would help adhesion. Cr or Ti adhesion layer would also help (a lot). For example, put 5 nm Cr between the substrate and the Mo.
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