I recently deposited LiF on the surface of my silicon detector made of a silicon semiconductor substrate. The top contact is aluminium and that is where the LiF was deposited on.

After deposition, I observed some cracks which led to some of the LiF come off the surface.

I normally use Edwards E306A Thermal Evaporator to perform the deposition process. The thickness of LiF deposited is about 6um.

Can anyone advise me on the best way to perform the deposition without have cracks after deposition? This can be from the viewpoint of pre-deposition, during or after the deposition.

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