I want to evaluate performance of heat spreading capacity of copper heat spreader. In which silicone chip (Source) is connected with Copper plate (Sink). I had simulate problem with steady state solver available in ANSYS APDL. To save computational time i had stated with 2D geometry. Is there any significant effect of third dimension in conduction heat transfer.
Dear Mehul,
i think mostly results will be closely same.
if geometry plays higher impact then results will vary.
It really depends on what are the geometrical dimensions of silicon chip and copper sink. As you may already know, researchers do work on the geometry of heat sink to provide more surface for heat spreading to environment, so choosing whether to use 2D or 3D is going to be largely dependent on the geometry. If you could provide the geometry and dimensions of your chip and heat spreader, it would be helpful for others to answer the question.
Good luck!!
In simulation of hot forging process we know that maximun differences between 2D and 3D models are 5% to 10%.
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