Using simple technique to calculate thermal conductivity or insulation in lab.
There is a transient method using a single wire embedded in the material. I think most articles on the topic are about 20 years old. Example: Application of the Transient Hot-Wire Technique to the Measurement of the Thermal Conductivity of
Solids. International Journal of Thermophysics, Vol. 23, No. 3, May 2002 (© 2002)
It is quite simple to set-up and the data aquisition can be made with a multimeter connected to a PC. The wire has to be a pure metal in order to be able to measure temperature from its resistance. Copper is a good candidate, though stability (oxidation) should be evaluated: make sure the electrical resistance stays the same after the experience.
I hope you want to calculate the thermal conductivity. If so please refer to the attachment how to use the Fourier’s law to calculate the thermal conductivity of a piece of a material with a simple experimental set-up.
1. E.Ya. Litovsky, M. Shapiro. Gas Pressure and Temperature Dependences of Thermal Conductivity Porous Ceramic Materials. Part I. Refractories and Ceramics with porosity below 30%, J. American Ceram Soc. 75 [12], pp. 3425-3439, (1992).
2. Litovsky E., M. Shapiro, A. Shavit, “Gas pressure and temperature dependences of thermal conductivity porous ceramic materials. Part II. Refractories and ceramics with porosity above 30%”, J. American Ceram. Soc., 79/5, 1996 1366-1376.
3. Litovsky E., T. Gambaryan-Roisman, M. Shapiro, A. Shavit, “Effect of Grain Thermal Expansion Mismatch on Thermal Conductivity of Porous Ceramics”, J. American Ceram. Soc. , vol 82, No 4, pp 994-1000, 1999.
4. Litovsky E., Gambaryan-Roisman T., Shapiro M. and Shavit A, Heat Transfer Mechanisms Governing Thermal Conductivity of Porous Materials, Trends in Heat, Mass & Momentum Transfer, Research Trends, Invited, Vol. 3, pp 147-167, 1997.
5. Litovsky E., Gambaryan-Roisman T., Shapiro M., Shavit A., “Novel heat transfer mechanisms in porous ceramic materials”, High Temperatures-High Pressures, 1(33): 2001, pp. 27-34.
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