My device structure goes on as follows 1. substrate, 2. FTO, 3. Compact TiO2, 4. Mesoporous TiO2, 5. Absorber material and 6. metal electrode deposition.
Can I use "conducting silver paste" as electrode? ( because my Voc is zero)
or
Can I go on with sputtering of "copper" ( presently not able to use gold as target )?
and also please answer why Voc goes to zero.
my perovskite absorber material system is verified by XRD.
compact TiO2 ( titanium isopropoxide + ethanol + mildly acidic )
Mesoporous TiO2 ( as told in literature )
Thanks
It means device does not have proper connection, you should etch the FTO glass before the fabrication.
Dear Vishesh,
It seems that your absorber film is not continuous and may contain voids and pin holes.
When you deposit the metal electrode it fills the voids and pinholes and causes short circuit with underlying TIO2 layer or even can reach to FTO layer.You must be sure from the homogeneity and continuity of the perovskite layer. For more information please follow the link: http://pubs.rsc.org/en/content/articlepdf/2015/CC/C5CC01483B,
wish you success
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