I want to use the hydrodynamic and thermaldynamic model to simulate the self heating effect in SOI FET, and this requires setting SurfaceResistance in the Thermomode. How should the value of SurfaceResistance be set?
Sentaurus TCAD is a semiconductor device simulation software suite developed by Synopsys. In Sentaurus TCAD, you can set the thermal boundary conditions to simulate heat transfer in semiconductor devices. Here are the general steps to set the thermal boundary conditions in Sentaurus TCAD:
1. Define the thermal regions: Identify the regions in your device where you want to specify the thermal boundary conditions. These regions can include the active semiconductor material, contacts, heat sinks, or any other component relevant to the heat transfer.
2. Assign thermal properties: Assign the appropriate thermal properties to each thermal region. These properties include the thermal conductivity, specific heat, and possibly the thermal resistivity if needed. You can find these properties from material data or experimental measurements.
3. Set boundary conditions: Specify the thermal boundary conditions at the interfaces or boundaries of the thermal regions. The specific boundary conditions depend on your device and simulation requirements. Common boundary conditions include:
- Temperature boundary condition: Set the temperature value or temperature profile at specific boundaries. This can represent, for example, a heat source, a fixed temperature boundary, or a heat sink.
- Heat flux boundary condition: Specify the heat flux, which represents the rate of heat transfer per unit area, at specific boundaries. This can represent, for example, a contact with a specific heat flux or a heat sink with a prescribed cooling rate.
- Insulated boundary condition: Set the boundary as insulated, indicating that there is no heat transfer across that boundary.
4. Apply appropriate models: Choose the appropriate heat transfer models and equations based on the physical phenomena you want to simulate. Sentaurus TCAD offers various thermal models, including Fourier's law of heat conduction, heat convection models, and radiative heat transfer models.
5. Run the simulation: After setting the thermal boundary conditions and configuring the thermal models, run the simulation in Sentaurus TCAD to solve the heat transfer equations and obtain the desired thermal distribution within the device.
It's important to note that the exact procedure for setting thermal boundary conditions in Sentaurus TCAD may vary depending on the specific version and configuration of the software. It's recommended to refer to the Sentaurus TCAD documentation and user guides for detailed instructions and examples specific to your version of the software.
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